2025-07-09 BY
IN Company News
In the semiconductor industry, Moore’s Law is edging closer to physical limits. So, boosting chip performance through 3D integration has become a core focus. Advanced packaging technologies like 2.5D/3D packaging and heterogeneous integration demand higher vertical interconnect density and better substrate performance.

 

Traditional silicon substrates are showing more limits. They struggle with high-frequency signal transmission, manufacturing costs, and process complexity. Glass substrates, however, are emerging as an ideal next-gen choice – thanks to unique advantages.

 

Through Glass Via (TGV) is the star here. It acts as “micro-channels” in chips, leading the shift from the “silicon era” to the “glass era” in semiconductor packaging.

 

What is TGV?
TGV refers to vertical electrical interconnects through glass substrates. It’s seen as a key next-gen 3D integration tech, potentially replacing silicon-based TSV (Through Silicon Via).

 

Made from high-quality borosilicate or quartz glass, TGV uses processes like laser induction, etching, seed layer sputtering, electroplating, chemical mechanical planarization (CMP), RDL, and bumping to enable 3D connections. These micro-vias typically range from 10μm to 100μm in diameter. For advanced packaging, each wafer may need tens of thousands to millions of metalized TGVs for conductivity.

 

Why TGV beats TSV?

 

  1. Better high-frequency performance: Glass is an insulator. Its dielectric constant is about 1/3 that of silicon. Its loss factor is 2-3 orders of magnitude lower. This cuts substrate loss and parasitic effects, keeping signals intact.
  2. Lower cost: Large, ultra-thin glass panels are easy to get. No need for insulating layers on the substrate or TGV walls. Glass interposers cost ~1/8 of silicon ones, slashing overall packaging costs.
  3. Simpler processes: No complex insulating layer deposition. No thinning for ultra-thin interposers. This streamlines production and boosts efficiency.
  4. Strong mechanical stability: Even when interposers are thinner than 100μm, warpage is small. This ensures packaging reliability.
  5. Wide applications: It shines in RF chips, high-end MEMS sensors, and high-density system integration. It’s a top pick for next-gen high-frequency chip 3D packaging.

“Sales Manager : Jinny
Email : sales1@xrjdcs.com
Whatsapp/Mobile:+86 15359273791″