CPU Speed:Up to 12 MHz

Memory Capacity:32 KB RAM, 32 KB ROM

Input/Output Channels:Up to 24 I/O channels

Communication Protocols:Modbus, CANopen, DeviceNet

Power Supply:12 V DC, 18 W

Operating Temperature:-20°C to 70°C

Storage Temperature:-40°C to 85°C

Enclosure Rating:IP20

Dimensions (WxHxD):89 mm x 90 mm x 52 mm

Weight:0.25 kg

    The Yokogawa F3SP21-0N CPU Module is engineered for precision and efficiency in industrial environments. Its compact yet powerful design ensures that it seamlessly integrates into various control systems, enhancing operational performance.

    Equipped with advanced processing capabilities, this module supports a wide range of applications, from basic control tasks to complex data processing, making it a versatile choice for modern industrial automation needs.

    Featuring a robust memory system, the F3SP21-0N ensures that critical operations are stored and accessed quickly and reliably, minimizing downtime and maximizing productivity.

    Designed for use in challenging environments, this CPU module operates within an extensive temperature range, ensuring stable performance in both cold and hot conditions. Its durable construction withstands the rigors of industrial settings, contributing to long-term reliability.

    Comprehensive communication interfaces enable seamless connectivity with other industrial devices, facilitating efficient data exchange and control over processes. Whether interfacing with sensors, actuators, or other control components, the F3SP21-0N ensures smooth operation and integration.

    With its optimized power consumption, the Yokogawa F3SP21-0N CPU Module operates efficiently, reducing energy costs without compromising on performance. This makes it an eco-friendly solution for industrial automation, aligning with sustainability goals while delivering high-quality results.