GE IC693CPU360-CE
1. Overview
2. Technical Specifications
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Parameter
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Specific Value/Feature
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|---|---|
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Model
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IC693CPU360-CE
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Processor
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32-bit 80386EX or RISC Architecture
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Clock Frequency
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25 MHz
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Operating Voltage
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5V DC (Power Supply)
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User Memory
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240KB Non-Volatile Flash (for user program storage)
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Data Memory
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1MB RAM (for runtime data processing)
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I/O Points
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2048 Points (Digital I/O, subject to specific configuration)
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Communication Interfaces
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1 x 10/100Mbps Ethernet, RS-232, RS-485, SNP
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|
Operating Temperature
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-20°C to 60°C
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Protection Rating
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IP65 (Dustproof and Waterproof)
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|
Dimensions
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Approx. 127mm x 89mm x 152mm (slight variations based on backplane type)
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|
Weight
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Approx. 450g
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3. Product Features
- High-Speed Processing Capability: Equipped with a 25MHz high-speed processor, this module delivers efficient execution of complex programming instructions including ladder diagrams, structured text, and other industrial control programming languages, ensuring responsive and stable control of industrial equipment and production lines.
- Large-Capacity Storage: Built with 240KB non-volatile user memory, it provides ample storage space for large-scale control programs, eliminating the risk of program data loss due to power outages and meeting the storage demands of sophisticated industrial control scenarios.
- High Reliability & Redundancy Support: Features redundant configuration functionality and supports backup CPU deployment, enabling automatic fault switching between primary and backup CPUs. This design minimizes system downtime and ensures continuous, high-availability operation of critical industrial control systems.
- Multi-Protocol Compatibility: Integrated with an Ethernet port, it supports mainstream industrial communication protocols such as Modbus TCP and Profibus, facilitating seamless integration with enterprise-level SCADA systems, MES systems, and other upper-level management platforms for efficient data transmission and centralized control.
- Modular Design: Adopts standardized slot design for easy plug-in installation, removal and replacement. The rugged and durable structure adapts to harsh industrial field environments, including high dust, high vibration and extreme temperature conditions, reducing maintenance difficulty and downtime.

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4. Structure & Components
- CPU Mainboard: The core circuit board of the module, integrating the central processing unit, memory chips, communication interface chips and other core hardware, responsible for core logic operations, data processing and signal transmission.
- Backplane: A metal frame mounted on the PLC dedicated backplane, responsible for stable power supply and unified signal distribution between the CPU module and other functional modules, ensuring reliable electrical connections.
- Connectors: Professional industrial connectors for stable connection with I/O modules, communication modules, power supplies and external equipment, guaranteeing uninterrupted signal and power transmission in harsh industrial environments.
- Fan & Heat Sink: Provides efficient heat dissipation under high-load operating conditions to prevent overheating damage to core components; some versions integrate the heat dissipation structure inside the CPU mainboard for a more compact design.
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5. Application Fields
- Process Control: Applied to process parameter monitoring and control of continuous production lines in chemical, petroleum, metallurgy and other industries, ensuring stable operation of production processes and compliance with process standards.
- Machine Automation: Serves as the control core for automated equipment such as packaging machinery, printing machinery and textile machinery, realizing automated operation, precision control and production efficiency improvement.
- Electric Power & Energy: Used in auxiliary control systems of power plants, power distribution automation systems and other power energy scenarios, supporting safe and stable operation of power facilities and intelligent power management.
- Building Facilities: Applied to the HVAC (Heating, Ventilation and Air Conditioning) system control of large buildings, realizing intelligent adjustment of building environmental parameters and energy-saving efficient operation of facility systems.
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6. Installation & Maintenance
6.1 Installation Steps
- Environment Confirmation: Verify that the installation environment temperature ranges from 0°C to 60°C, and avoid high-humidity, high-dust and corrosive gas environments to ensure stable module operation.
- Backplane Insertion: Insert the IC693CPU360-CE module into the dedicated CPU slot of the Series 90-30 PLC backplane, align the positioning pins correctly, and ensure the module is firmly seated without loose connections.
- Power Connection: Connect the 5V DC power cable strictly according to the polarity marking, avoid reverse polarity connection to prevent damage to the module’s internal circuits.
- I/O Connection: Connect with digital/analog I/O modules via the backplane, or directly link external sensors, actuators and other field equipment to complete the hardware control loop.
- Communication Configuration: Connect Ethernet cables or serial cables, configure the IP address, subnet mask, gateway and corresponding communication protocols as required to realize data interaction with upper-level systems and peripheral equipment.
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