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8K Improves Healthcare Greatly

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Longsys’ Custom Storage for 8K

8K’s Growth Needs Better Storage

Anchoring Dual Carbon Goals: Leading Industry Transformation with Sustainable Practices

02 Scenario-Based Innovation: Unlocking Full-Process Industrial Needs

One-Story Integrated Scenario System for Full Product Portfolio

LNG Processing Scenario Simulation System

Fermentation Monitoring Scenario Simulation System

Tank Farm Metering System

Quantitative Loading/Unloading Vehicle System

Digital Platform Solution

• OmniCore™ controller motion demo: The new OmniCore controller works with three IRB 1300 robots. They complete difficult tasks with fragile glass cups—path accuracy within 0.6mm and speed up to 1600mm/s. Compared to old models, it is 25% faster and uses 20% less energy, proving new tech balances precision and speed.
• “Follow me” AI solution: Using AI algorithms, robots can record operators’ tool movements. They convert these into their own programs to quickly finish grinding debugging. It skips traditional programming steps, suitable for small-batch, multi-variety production and lowering automation barriers for SMEs.
• PoWa collaborative robot display: A new product under “Lingyu Huazhang”, it is flexible in welding and loading/unloading. It combines industrial-grade speed, collaborative safety and lightweight design advantages.

AI and Strategic Partnerships Pave the Collaborative Path Forward

Global “Lighthouse Factory” recognition remains elusive for China’s domestic life sciences firms. Currently, all three Chinese life sciences Lighthouses belong to multinationals. Breaking this pattern requires overcoming major hurdles:

Key Challenges Include:

Navigating complex GMP/GxP regulations.

Managing intricate bioprocessing and sterile manufacturing.

Funding large-scale digital transformation.

Bridging the IT/OT/life sciences talent gap.

Three Forces Enable Progress:

Policy Acceleration:
China’s *Pharmaceutical Industry Digitalization Plan (2025-2030)* explicitly promotes AI across the value chain.

AI as the Essential Engine:
86% of new Lighthouse use cases utilize AI. Therefore, domestic firms must embed AI in core areas like visual inspection and predictive maintenance to demonstrate measurable impact (e.g., 30% energy reduction).

Lighthouse Ripple Effects:
Successful factories elevate entire ecosystems:

Boost R&D innovation through digital twins/AI.

Strengthen supply chain transparency and resilience.

Advance sustainability goals (e.g., Schneider’s Wuxi Sustainable Lighthouse).

Importantly, multinational successes in China (e.g., 82% productivity gains) provide local learning opportunities.

The Partner Imperative:
Experienced enablers like Schneider Electric accelerate the journey:

Dual Expertise: Operates 7 global Lighthouses while deeply understanding life sciences compliance.

End-to-End Guidance: Delivers strategy planning, technology integration (BMS/MES/AI), and Lighthouse application support.

Value-First Approach: Focuses on solving specific pain points – like cutting defect rates or shortening delivery times – rather than technology overload.

Consequently, collaboration is vital. Through strategic AI adoption, policy alignment, and expert partnerships, China’s domestic life sciences sector is poised to illuminate its own Lighthouse success stories, driving industry-wide advancement.

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Email: johnedward.zch@gmail.com
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When an alarm blared at 6 a.m. in a Shanghai waste-to-energy plant—signaling critical furnace overheating—an AI vision system took autonomous action. Within minutes, it stabilized combustion by auto-adjusting fuel and airflow. This intelligent control solution, co-developed by Schneider Electric and partners, integrates machine vision with real-time optimization algorithms for precision industrial automation.

“AI industrialization has entered an ecosystem-driven era,” declared Yi Xiong, SVP of Schneider Electric China. “Isolated technologies cannot bridge the industrialization gap when AI moves from labs to boiler rooms.” He framed scaling as a triple relay race:

1. Technology Integration: Full-stack capabilities require collaboration. For example, their waste-plant AI merges computer vision, optimization algorithms, and control systems—beyond any single company’s scope.

2. Scenario Expertise: Lacking mechanical insight, even advanced algorithms fail. In a wind-turbine project, 20 years of vibration analysis from partners enabled accurate bearing-failure models.

3. Scaling Networks: Replicating pilot successes demands open platforms. Schneider’s “Go Green” initiative has scaled an AI quality-inspection solution from its Wuxi factory to 12 manufacturers.

Three Engines for Ecosystem Competitiveness
Schneider’s ecosystem strategy rests on:

• Open Culture: Internal “Impact” values break silos. In 2024, logistics teams shared predictive delay models with production units.

• Technical Leadership: 200% AI patent growth in three years; 99.2% accuracy in industrial visual recognition anchors partnerships.

• Hybrid Talent: “Digital Citizen” program trains engineers mastering both Modbus protocols and Python. 500 OT-AI experts will be certified by 2025.

Ecosystem in Motion
Vertical Depth:

• “Go Green” with MIIT yielded 40+ co-innovations, including an AI energy optimizer cutting power use by 12% at 30 plants.

• Joint lab with NVIDIA developed smart cabinets reducing GPU cluster energy by 15%.

Horizontal Expansion:

• World’s first hydrogen-equipment digital twin with Zhejiang Hydrogen Center slashes electrolyzer fault-response time by 90%.

• Open-source knowledge graphs help SMEs reduce manual data labeling by 80%.

Tangible outcomes include two “Lighthouse Factories”: Wuxi boosted product yield to 99.98% via AI process optimization, while Shanghai improved logistics efficiency by 40%. Concurrently, the “AI for GREEN” report warns that computing power’s energy demands require industry-wide collaboration.

“Ecosystem synergy is a marathon,” Xiong concluded. At WAIC 2025 (July 26), Schneider will unveil an industrial AI “toolkit” co-created with partners, spanning predictive maintenance and energy optimization across 20 scenarios. “Passing the ecosystem baton is key to winning the last mile of AI industrialization.”

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Email: johnedward.zch@gmail.com
Mobile：+86 13806028623（WhatsApp）
Sales Manager ：John

I. Technical Deconstruction: Full-Dimensional Innovation from Hardware Design to Algorithm Optimization

1. Precise Collaboration of Core Components
   The integrated IGCT devices in the module adopt nanoscale lithography, with a chip thickness only 1/3 that of traditional thyristors. Switching frequency is increased to 20kHz, while conduction loss is reduced by 40%. The supporting drive circuit uses adaptive gain control technology, automatically adjusting drive voltage based on load changes to prevent IGCT damage from overvoltage or undervoltage.
2. Breakthrough Improvements in Anti-Interference Capability
   Through double-layer metal shielding and digital filtering algorithms, the module maintains phase measurement errors within ±0.05° even in strong electromagnetic interference environments of 1000V/m. After application in the welding workshop of an automobile manufacturing plant, frequency converter misoperation rates dropped from 3 times per month to zero.
3. Digitally Empowered Underlying Architecture
   The built-in edge computing unit supports OPC UA protocol, enabling real-time upload of over 300 operating parameters. In ABB Xiamen Industrial Center’s photovoltaic system, AI algorithms analyzing historical data predicted heat dissipation system failures 72 hours in advance, reducing downtime by 80%.

II. Industry Practices: Cross-Domain Value Verification from Thermal Power to New Energy

1. Energy Efficiency Revolution in Thermal Power
   In the renovation project of Datang Yungang Power Plant, the S-073N module, combined with the PM866K01 controller, optimized the steam inlet phase of steam turbines, increasing unit thermal efficiency by 2.1%. This saves 12,000 tons of standard coal annually and reduces CO₂ emissions by 35,000 tons, earning the project the “Green Power Plant Demonstration Project” award from the China Electricity Council.
2. Precise Control in Rail Transit
   Shenzhen Metro Line 14 adopted the S-073N module to build a traction frequency conversion system. Through phase closed-loop control, the train’s starting inrush current was reduced by 50%, significantly improving passenger comfort. Meanwhile, system energy consumption decreased by 18% compared to traditional solutions, saving over 5 million yuan in annual electricity costs.
3. Precision Assurance in High-End Manufacturing
   A semiconductor wafer factory applied the module in the lithography machine’s drive system. With ±0.1° phase control precision, wafer etching errors were reduced from ±3nm to ±1.5nm, increasing yield by 5 percentage points and adding over 200 million yuan in annual benefits per production line.

III. Competitive Barriers: A Dual Moat of Technical Patents and Ecosystem Building

1. First-Mover Advantage in Patent Layout
   ABB has filed 127 global patents covering IGCT technology and phase control algorithms, with core patents spanning key areas such as chip design, heat dissipation structures, and digital interfaces. These patents form technical barriers that competitors cannot easily replicate in the short term.
2. Synergistic Effects of an Open Ecosystem
   The module is compatible with third-party development platforms and has established strategic cooperation with Rockwell, Hollysys, and other manufacturers. In a lithium battery production line, the S-073N module and Rockwell PLC formed a hybrid control system, achieving dynamic matching of coater phase and tension through data exchange, improving product consistency by 30%.
3. Full-Lifecycle Service System
   ABB launched a “Module-as-a-Service (MaaS)” model, allowing customers to pay by usage duration and enjoy one-stop services including predictive maintenance, software upgrades, and rapid fault response. After adopting this model, a chemical enterprise increased overall equipment effectiveness (OEE) by 12% and reduced operation and maintenance costs by 40%.

IV. Market Insights: A Path to High-End Breakthroughs Amid Domestic Substitution

V. Future Outlook: Deep Integration of AI and Industrial Control

EEM: Growing From a Vision to a Global Network

“Scale Is Now the Big Challenge”

Data Gaps: A Major Hurdle

Global Collaboration: Learning From Each Other

China’s Role: Leading by Example

From “Must-Do” to “Want to Do”

The Basics of TGV

TGV’s Core Processes

1.Glass substrate prep: Pick ultra-thin glass with specific composition, thickness, and surface quality.

2.Laser drilling/etching: Use femtosecond lasers or wet/dry etching to create micro-holes.

3.Insulation and seed layer deposition: Add an insulating layer on hole walls for electrical isolation. Then deposit a metal seed layer.

4.Electroplating: Fill vias fully with metal (mostly copper) via electroplating.

5.Surface planarization (CMP): Polish away excess metal for a flat glass surface.

6.RDL fabrication: Deposit insulation on the glass, pattern it, and electroplate wiring to form interconnect circuits.

7.Testing and dicing: Test the interconnected wafer, then cut into individual chiplets for further packaging.

Why TGV Matters

What is TGV?
TGV refers to vertical electrical interconnects through glass substrates. It’s seen as a key next-gen 3D integration tech, potentially replacing silicon-based TSV (Through Silicon Via).

1. Better high-frequency performance: Glass is an insulator. Its dielectric constant is about 1/3 that of silicon. Its loss factor is 2-3 orders of magnitude lower. This cuts substrate loss and parasitic effects, keeping signals intact.
2. Lower cost: Large, ultra-thin glass panels are easy to get. No need for insulating layers on the substrate or TGV walls. Glass interposers cost ~1/8 of silicon ones, slashing overall packaging costs.
3. Simpler processes: No complex insulating layer deposition. No thinning for ultra-thin interposers. This streamlines production and boosts efficiency.
4. Strong mechanical stability: Even when interposers are thinner than 100μm, warpage is small. This ensures packaging reliability.
5. Wide applications: It shines in RF chips, high-end MEMS sensors, and high-density system integration. It’s a top pick for next-gen high-frequency chip 3D packaging.

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Email : sales1@xrjdcs.com
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Technological Iteration and Scenario Adaptation: The Value Breakthrough of Agile Innovation

Industrial Chain Collaboration: From Isolated Competition to Ecological Win-Win in Global Practices

China-Centric Strategy: Localized R&D Drives Global Value Output

• Email: x13806028623@gmail.com
  Email: johnedward.zch@gmail.com
  Mobile：+86 13806028623（WhatsApp）
  Sales Manager ：John